Publications

3 results for Osamu Suzuki

No Clean Flux technology for large die flip chip packages
- - Akihiro Horibe
  - Kang-Wook Lee
  - et al.
- 2013
- ECTC 2013
Vacuum underfill technology for advanced packaging (IMPACT 2011)
- - M. Hoshiyama
  - M. Hasegawa
  - et al.
- 2011
- IMPACT 2011
Vacuum underfill technology for advanced packaging
- - Akihiro Horibe
  - M.-C. Paquet
  - et al.
- 2011
- ECTC 2011