Publications

2 results for Dave Motschman

Through silicon via aware design planning for thermally efficient 3-D integrated circuits
- - Yibo Chen
  - Eren Kursun
  - et al.
- 2013
- IEEE TCADIS
Paper
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs
- - Yibo Chen
  - Eren Kursun
  - et al.
- 2011
- ISLPED 2011
Conference paper