Reducing time dependent line to line leakage following post CMP clean
- Donald F. Canaperi
- Satyavolu S. Papa Rao
- et al.
- 2010
- MRS Online Proceedings Library
Publications
27 results for T. Levin
Fully depleted extremely thin SOI technology fabricated by a novel integration scheme featuring implant-free, zero-silicon-loss, and faceted raised source/drain
- K. Cheng
- A. Khakifirooz
- et al.
- 2009
- VLSI Technology 2009
Copper contact metallization for 22 nm and beyond
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2009
- IITC 2009
22 nm technology compatible fully functional 0.1 μm 2 6T-sram cell
- B. Haran
- A. Kumar
- et al.
- 2008
- IEDM 2008
Quantitative coherent diffractive imaging of an integrated circuit at a spatial resolution of 20 nm
- Brian Abbey
- Garth J. Williams
- et al.
- 2008
- Applied Physics Letters
Stress migration lifetime for Cu interconnects with CoWP-only cap
- Jeffrey P. Gambino
- Christy L. Johnson
- et al.
- 2006
- IEEE T-DMR
Imaging material components of an integrated circuit interconnect
- Zachary H. Levine
- Steven Grantham
- et al.
- 2003
- Journal of Applied Physics