Publications

149 results for C. K. Hu‬

A 0.5 μm fully scaled two-level metal fully planarized interconnect structure fabricated with X-ray lithography
- - D. Moy
  - L.K. Wang
  - et al.
- 1990
- VLSI Technology 1990
Dry etching of TiN/Al(Cu)/Si for very large scale integrated local interconnections
- - K.W. Choi
  - N.J. Mazzeo
  - et al.
- 1990
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Two-level metal fully planarized interconnect structure implemented on a 64 kb CMOS SRAM
- - D. Moy
  - M. Schadt
  - et al.
- 1989
- VMIC 1989
0.5 μm CMOS devices and circuits fabricated using synchrotron X-ray lithography
- - L.K. Wang
  - C.H. Hsu
  - et al.
- 1989
- VLSI Technology 1989
On the preparation of cross-sectional TEM samples using lithographic processing and reactive ion-etching
- - J.T. Wetzel
  - M. Jost
  - et al.
- 1989
- Ultramicroscopy
A process for improved Al (Cu) reactive ion etching
- - C.-K. Hu
  - B. Canney
  - et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
REACTIVE ION ETCHING OF Al(Cu) ALLOYS.
- - C.-K. Hu
  - M.B. Small
  - et al.
- 1986
- MRS Fall Meeting 1986
DIFFUSION BARRIER STUDIES FOR Cu.
- - C.-K. Hu
  - S. Chang
  - et al.
- 1985
- VMIC 1985
TEMPERATURE DEPENDENCE OF STRESSES IN Ti, Cr, AND Cu THIN FILMS.
- - C.-K. Hu
  - D. Gupta
  - et al.
- 1984
- VMIC 1984