Electromigration in on-chip single/dual damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- JES
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149 results for C. K. Hu
Low-Temperature Chemical Vapor Deposition of High-Purity Copper from an Organometallic Source
- David B. Beach
- Francoise K. LeGoues
- et al.
- 2002
- Chemistry of Materials
Electromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching
- R. Filippi
- M. Gribelyuk
- et al.
- 2001
- Thin Solid Films
Electromigration of copper in Al(0.25 at.% Cu) conductor lines
- H.K. Kao
- G.S. Cargill III
- et al.
- 2001
- Journal of Applied Physics
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2001
- Applied Physics Letters
Quantitative metrology study of Cu/SiO2 interconnect structures using fluorescence x-ray microscopy
- Guangyong Xu
- X. Su
- et al.
- 2001
- Applied Physics Letters
Quantitative nanoscale metrology study of Cu/SiO2 interconnect technology using transmission x-ray microscopy
- X. Su
- C.B. Stagarescu
- et al.
- 2000
- Applied Physics Letters
Copper metallization for high performance silicon technology
- R. Rosenberg
- D. Edelstein
- et al.
- 2000
- Annual Review of Materials Science
Concentration and stress evolution during electromigration in passivated Al(0.25 at.% Cu) conductor lines
- H.K. Kao
- G.S. Cargill
- et al.
- 2000
- Materials Research Society Symposium-Proceedings
X-ray microbeam studies of electromigration
- G.S. Cargill III
- A.C. Ho
- et al.
- 1999
- Materials Research Society Symposium - Proceedings