Graphite Sheet Embedded in an Organic Flip-Chip Package for Heat Spreading
- Keiji Matsumoto
- Daisuke Oshima
- et al.
- 2025
- ECTC 2025
Conference paper
Publications
6 results for Atom O. Watanabe
A Heterogeneously Integrated 256-Element 5G Phased Array: Design, Assembly, Test
- Bodhisatwa Sadhu
- Arun Paidimarri
- et al.
- 2025
- IEEE Journal of Microwaves
PaperSignal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- Ram Krishna
- Atom O. Watanabe
- et al.
- 2023
- ECTC 2023
Conference paperA Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array
- Duixian Liu
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Conference paperElectrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- Atom O. Watanabe
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Conference paperA Methodology to Optimize the Number and Placement of Decoupling Capacitors in a Multilevel Power Delivery Network
- Ram Krishna
- Thong Nguyen
- et al.
- 2022
- EDAPS 2022
Conference paper