Effect of surface temperature on GeSbTe damage formation during plasma processingL. BuziJ. M. Papaliaet al.2021SPIE Advanced Lithography 2021
Si Incorporation Into AsSeGe Chalcogenides for High Thermal Stability, High Endurance and Extremely Low Vth Drift 3D Stackable Cross-point MemoryHuai-Yu ChengI. Kuoet al.2020VLSI Technology 2020
A no-verification Multi-Level-Cell (MLC) operation in Cross-Point OTS-PCMNanbo GongW. Chienet al.2020VLSI Technology 2020
Utilizing photosensitive polymers to evaluate UV radiation exposures in different plasma chamber configurationsL. BuziHiroyuki Miyazoeet al.2020JVSTA
Hydrocarbon layer formation and removal studies on SiN films etched in halogen/hydrofluorocarbon plasmasL. BuziJ. M. Papaliaet al.2020SPIE Advanced Lithography 2020