Publications

3 results for Yasuhiro Kawase

Pre-applied inter chip fill for 3D-IC joining
- - Yasuhiro Kawase
  - Makoto Ikemoto
  - et al.
- 2014
- IMAPS 2014
High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks
- - Keiji Matsumoto
  - Hiroyuki Mori
  - et al.
- 2014
- SEMI-THERM 2014
High thermal conductive inter chip fill for 3D-IC through pre-applied joining process
- - Y. Kawase
  - M. Ikemoto
  - et al.
- 2013
- IMAPS 2013