Publications

28 results for Dale McHerron

PECVD Low-k (∼2.7) dielectric SiCOH film development and integration for 65 nm CMOS devices
- - K. Ida
  - S. Nguyen
  - et al.
- 2005
- AMC 2005
BEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65nm groundrules
- - S. Lane
  - M. Fukasawa
  - et al.
- 2005
- AMC 2005
BEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65 nm groundrules
- - M. Fukasawa
  - S. Lane
  - et al.
- 2005
- IITC 2005
Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- Optics East 2005
High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
- - E. Leobandung
  - H. Nayakama
  - et al.
- 2005
- VLSI Technology 2005
Lower-k SiCOH integration for 65 nm ground rules
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- VMIC 2005
Large format fabrication a practical approach to low cost MCM-d
- - George E. White
  - Eric Perfecto
  - et al.
- 1994
- MCMC 1994
Dielectric anisotropy of BPDA-PDA polyimide and its effect on electrical characteristics of interconnects
- - A. Deutsch
  - M. Swaminathan
  - et al.
- 1993
- IEEE Topical Meeting EPEPS 1993