Performance of ultrathin alternative diffusion barrier metals for next - Generation BEOL technologies, and their effects on reliabilityTakeshi NogamiM. Chaeet al.2014IITC/AMC 2014Conference paper
BEOL Cu CMP process evaluation for advanced technology nodesKunaljeet TanwarDonald Canaperiet al.2013JESPaper
CVD-Co/Cu(Mn) integration and reliability for 10 nm nodeTakeshi NogamiM. Heet al.2013IITC 2013Conference paper
Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentalsTakeshi NogamiC. Pennyet al.2012IEDM 2012Conference paper