Co-packaged optics module with single mode polymer waveguide
- Akihiro Horibe
- Yoichi Taira
- et al.
- 2025
- IEDM 2025
Publications
3 results for Hsiang Han Hsu
D2W and W2W Hybrid bonding system with below 2.5 micron pitch for 3D chiplet AI applications
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2024
- IEDM 2024
In-silico Polymer Generation using fine-tuned Regression Transformers with Open Reference Data
- Ronaldo Giro
- Hsiang Han Hsu
- et al.
- 2023
- MRS Fall Meeting 2023