Analysis of plasma-induced modification of ULK and eULK Materials: Dual damascene processing challenges for 45nm (κ ≤ 2.4) and beyond BEOL technologies
- N. Fuller
- M.A. Worsley
- et al.
- 2006
- IITC 2006
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66 results for Geraud Dubois
Laser spike annealing: A novel post-porosity treatment for significant toughening of low-k organosilicates
- Willi Volksen
- Geraud Dubois
- et al.
- 2006
- IITC 2006
Laser spike annealing: A novel post-porosity treatment for toughening of low-k organosilicates
- Willi Volksen
- Geraud Dubois
- et al.
- 2006
- VMIC 2006
New spin-on oxycarbosilane low-k dielectric materials with exceptional mechanical properties
- Dubois Geraud
- Teddie Magbitang
- et al.
- 2005
- IITC 2005
Mechanical and dielectric characterization of low-k, porous organosilicates
- Willi Volksen
- Teddie P. Magbitang
- et al.
- 2005
- VMIC 2005
New spin-on oxycarbosilane low-k dielectric materials with exceptional mechanical properties
- Dubois Geraud
- Teddie Magbitang
- et al.
- 2005
- VMIC 2005
Synthesis of Polyimides in Molecular-Scale Confinement for Low-Density Hybrid Nanocomposites
- Scott G. Isaacson
- Jade I. Fostvedt
- et al.
- 2017
- Nano Letters
Surface Chemical Functionalization to Achieve Extreme Levels of Molecular Confinement in Hybrid Nanocomposites
- Can Wang
- Scott G. Isaacson
- et al.
- 2019
- Advanced Functional Materials
Using Unentangled Oligomers to Toughen Materials
- Scott G. Isaacson
- Yusuke Matsuda
- et al.
- 2018
- ACS AMI
Accurate measurement of porous low-k thin-films by nanoindentation: Densification scaling versus substrate effects
- Krystelle Lionti
- Kumar Virwani
- et al.
- 2017
- ECS J. Solid State Sci. Technol.