Self-Alignment of active Si Bridge using solder joint capillary forcesThomas LesueurDavid Danovitchet al.2025ECTC 2025
Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)Hafiz Wakas AliDavid Danovitchet al.2023ECTC 2023