Publications

2 results for Duixian Liu

Module, antenna, and package design considerations for mm-scale IoT devices
- - Arun Paidimarri
  - Duixian Liu
  - et al.
- 2023
- ECTC 2023
Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond
- - Xiaoxiong Gu
  - Duixian Liu
  - et al.
- 2021
- IEEE Journal of Microwaves