Publications

201 results for Bruno Michel

Thermofluidics and energetics of a manifold microchannel heat sink for electronics with recovered hot water as working fluid
- - Chander Shekhar Sharma
  - Manish K. Tiwari
  - et al.
- 2013
- Int. J. Heat Mass Transf.
Patterned die-to-die thin film bonding for 3D chip stacks with integrated microfluidic cooling
- - Yassir Madhour
  - Thomas Brunschwiler
  - et al.
- 2012
- ICEPT 2012
Hot water cooled electronics for high exergetic utility
- - Severin Zimmermann
  - Manish K. Tiwari
  - et al.
- 2012
- ASME HT 2012
Centrifugal formulation of percolating thermal underfills for flip-chip applications
- - Jonas Zuercher
  - Javier V. Goicochea
  - et al.
- 2012
- CIPS 2012
Thermal management and overall performance of a high concentration PV
- - Werner Escher
  - Stephan Paredes
  - et al.
- 2012
- CPV 2012
Enhanced centrifugal percolating thermal underfills based on neck formation by capillary bridging
- - Javier V. Goicochea
  - Thomas Brunschwiler
  - et al.
- 2012
- ITherm 2012
Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
- - Thomas Brunschwiler
  - Stephan Paredes
  - et al.
- 2012
- ITherm 2012
Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics
- - Manish K. Tiwari
  - Severin Zimmermann
  - et al.
- 2012
- ITherm 2012
A novel concept of energy reuse from high concentration photovoltaic thermal (HCPVT) system for desalination
- - Chin Lee Ong
  - W. Escher
  - et al.
- 2012
- Desalination
A multivariate parameter analysis of copper pillars eases the design of denser interconnects
- - Gerd Schlottig
  - Thomas Brunschwiler
  - et al.
- 2012
- EuroSimE 2012