Publications

201 results for Bruno Michel

Energy-efficient variable-flow liquid cooling in 3D stacked architectures
- - Ayse K. Coskun
  - David Atienza
  - et al.
- 2010
- DATE 2010
Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design
- - R. Wälchli
  - Thomas Brunschwiler
  - et al.
- 2010
- Int. J. Heat Mass Transf.
Hotspot-adapted cold plates to maximize system efficiency
- - Thomas Brunschwiler
  - Hugo Rothuizen
  - et al.
- 2009
- THERMINIC 2009
Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks
- - T. Brunschwiler
  - S. Paredes
  - et al.
- 2009
- 3DIC 2009
Hotspot-optimized interlayer cooling in vertically integrated packages
- - T. Brunschwiler
  - Bruno Michel
  - et al.
- 2008
- MRS Fall Meeting 2008
A benchmark study on the thermal conductivity of nanofluids
- - Jacopo Buongiorno
  - David C. Venerus
  - et al.
- 2009
- Journal of Applied Physics
Thermal rectification at water/functionalized silica interfaces
- - Ming Hu
  - Javier V. Goicochea
  - et al.
- 2009
- Applied Physics Letters
Comparison of transient and static test methods for chip-to-sink thermal interface characterization
- - B. Smith
  - T. Brunschwiler
  - et al.
- 2009
- Microelectronics Journal
On the thermal conductivity of gold nanoparticle colloids
- - Natallia Shalkevich
  - Werner Escher
  - et al.
- 2009
- Langmuir
Effect of inlet orifice on saturated CHF and flow visualization in multi-microchannel heat sinks
- - Jung Eung Park
  - John R. Thome
  - et al.
- 2009
- SEMI-THERM 2009