Publications

2 results for Qingyun Yang

Characterization of TSV etch from a sustainability standpoint
- - Osakpolo Isowamwen
  - Nathan Marchack
  - et al.
- 2023
- SPIE Advanced Lithography 2023
Control of sidewall roughness formation in through-silicon via etch at non-cryogenic temperatures
- - John M. Papalia
  - Devi Koty
  - et al.
- 2022
- SPIE Advanced Lithography 2022