Publications

28 results for Patrick W. Dehaven

Extendibility study of PVD Cu seedlayers in 90nm-groundrule lines and vias
- - A. Simon
  - S.B. Law
  - et al.
- 2004
- AMC 2004
Low-temperature melt processing of organic-inorganic hybrid films
- - David B. Mitzi
  - David R. Medeiros
  - et al.
- 2002
- Chemistry of Materials
Crystallographic texture and phase metrology during damascene copper processing
- - K.J. Kozaczek
  - P. DeHaven
  - et al.
- 2002
- MRS Proceedings 2002
An optimal liner for copper damascene interconnects
- - D. Edelstein
  - C. Uzoh
  - et al.
- 2001
- ADMETA 2001
In-situ study of Ti/TiN stability under nitrogen anneal
- - P. DeHaven
  - K.P. Rodbell
  - et al.
- 1999
- MRS Spring Meeting 1999
Metallization by plating for high-performance multichip modules
- - K.K.H. Wong
  - S. Kaja
  - et al.
- 1998
- IBM J. Res. Dev
Film crystallographic texture and substrate surface roughness in layered aluminum metallization
- - K.P. Rodbell
  - V. Svilan
  - et al.
- 1996
- MRS Spring Meeting 1996
Blanket and local crystallographic texture determination in layered Al metallization
- - K.P. Rodbell
  - J.L. Hurd
  - et al.
- 1995
- MRS Fall Meeting 1995