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On implementation of embedded Phosphorus-doped SiC stressors in SOI nMOSFETsZhibin RenG. Peiet al.2008VLSI Technology 2008
Higher hole mobility induced by twisted Direct Silicon Bonding (DSB)M. HamaguchiH. Yinet al.2008VLSI Technology 2008
Effect of end-of-range defects on device leakage in direct silicon bonded (DSB) technologyHaizhou YinM. Hamaguchiet al.2008VLSI-TSA 2008
(110) Channel, SiON gate-dielectric PMOS with record high Ion=1 mA/μm through channel stress and source drain external resistance (R ext) engineeringB. YangA. Waiteet al.2007IEDM 2007
High performance transistors featured in an aggressively scaled 45nm bulk CMOS technologyZ. LuoN. Rovedoet al.2007VLSI Technology 2007
High-performance high-κ/metal gates for 45nm CMOS and beyond with gate-first processingM. ChudzikB. Doriset al.2007VLSI Technology 2007
Scalability of Direct Silicon Bonded (DSB) technology for 32nm node and beyondHaizhou YinC.Y. Sunget al.2007VLSI Technology 2007
Ultra-thin SOI replacement gate CMOS with ALD TaN / high-k gate stackB. DorisB.P. Linderet al.2005VLSI-TSA 2005
Robust TaN x diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer depositionH. KimC. Detavenieret al.2005Journal of Applied Physics