Publications

2 results for Piotr Warszynski

Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds
- - Jonas Zürcher
  - Xi Chen
  - et al.
- 2015
- NANO 2015
Conference paper
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
- - Jonas Zürcher
  - Kerry Yu
  - et al.
- 2015
- ECTC 2015
Conference paper