Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment
- Naoko Unami
- Hirokazu Noma
- et al.
- 2011
- APM 2011
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19 results for Hirokazu Noma
Microstructure observation of electromigration behavior in peripheral C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMAPS 2011
Effect of preformed IMC layer on electromigration of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMPACT 2011
High-bandwidth density optical I/O for high-speed logic chip on waveguide-integrated organic carrier
- Masao Tokunari
- Yutaka Tsukada
- et al.
- 2011
- ECTC 2011
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
IMC bonding for 3D interconnection
- Katsuyuki Sakuma
- Kuniaki Sueoka
- et al.
- 2010
- ECTC 2010
Injection molded solder - a new fine pitch substrate bumping method
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2009
- ECTC 2009
Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2009
- ECTC 2009