Publications

8 results for Adam Ticknor

Microreplicated conditioners for Cu barrier chemical-mechanical planarization (CMP)
- - Wei-Tsu Tseng
  - Sana Rafie
  - et al.
- 2015
- ECS J. Solid State Sci. Technol.
Post cu cmp cleaning of polyurethane pad debris
- - Wei-Tsu Tseng
  - Elliott Rill
  - et al.
- 2013
- ECS J. Solid State Sci. Technol.
Post copper CMP hybrid clean process for advanced BEOL technology
- - Wei-Tsu Tseng
  - Vamsi Devarapalli
  - et al.
- 2013
- IEEE Trans Semicond Manuf
Hybrid clean approach for post-copper CMP defect reduction
- - Wei-Tsu Tseng
  - Vamsi Devarapalli
  - et al.
- 2013
- ASMC 2013
Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes
- - Wei-Tsu Tseng
  - Donald Canaperi
  - et al.
- 2012
- ASMC 2012
Chemical-mechanical polishing of SiCOH-based low-k dielectrics
- - Wei-Tsu Tseng
  - Akihisa Sakamoto
  - et al.
- 2006
- ECS Meeting 2006
A high-speed, high-sensitivity silicon lateral trench photodetector
- - Min Yang
  - Kern Rim
  - et al.
- 2002
- IEEE Electron Device Letters
70 nm damascene-gate MOSFETs with minimal polysilicon gate-depletion
- - Hussein I. Hanafi
  - Russell Arndt
  - et al.
- 2001
- ESSDERC 2001