Effect of impurity on Cu electromigration
- C.-K. Hu
- Matthew Angyal
- et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
Publications
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140 results for Lynne Gignac
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009
Gate-all-around silicon nanowire 25-stage CMOS ring oscillators with diameter down to 3 nm
- Sarunya Bangsaruntip
- A. Majumdar
- et al.
- 2010
- VLSI Technology 2010
Gate-all-around silicon nanowire MOSFETs and circuits
- Jeffrey W. Sleight
- Sarunya Bangsaruntip
- et al.
- 2010
- DRC 2010
Interface state density measurements in gated p-i-n silicon nanowires as a function of the nanowire diameter
- Guy Cohen
- E. Cartier
- et al.
- 2010
- DRC 2010
High performance and highly uniform metal hi-k gate-all-around silicon nanowire mosfets
- Jeffrey W. Sleight
- Sarunya Bangsaruntip
- et al.
- 2010
- ECS Transactions
Material and process for advanced Cu/ULK integration
- Chih-Chao Yang
- Daniel C. Edelstein
- et al.
- 2008
- ADMETA 2008
Measurements of carrier transport in MOSFETs with bottom-up nanowire channel as a function of the nanowire diameter
- G.M. Cohen
- S. Bangsaruntip
- et al.
- 2008
- DRC 2008
The effect of microstructure on resistivity and reliability in copper interconnects
- Lynne M. Gignac
- C.-K. Hu
- et al.
- 2007
- AMC 2007
Channel Strain Characterization in Embedded SiGe by Nano-beam Diffraction
- J. Li
- A. Lamberti
- et al.
- 2008
- ECS Meeting 2008