Publications

8 results for Heinz-Dietrich Brüns

Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
- - Sebastian Müller
  - Torsten Reuschel
  - et al.
- 2015
- IEEE Trans Electromagn Compat
Using via stubs in periodic structures for microwave filter design
- - Andreas Hardock
  - Young H. Kwark
  - et al.
- 2014
- IEEE Transactions on CPMT
Application of vias as functional elements in microwave coupling structures
- - Andreas Hardock
  - Renato Rimolo-Donadio
  - et al.
- 2013
- IEEE T-MTT
Analytical extraction of via near-field coupling using a multiple scattering approach
- - Sebastian Muller
  - Andreas Hardock
  - et al.
- 2013
- SPI 2013
Complete modeling of large via constellations in multilayer printed circuit boards
- - Sebastian Müller
  - Fabian Happ
  - et al.
- 2013
- IEEE Transactions on CPMT
Accuracy of physics-based via models for simulation of dense via arrays
- - Sebastian Müller
  - Xiaomin Duan
  - et al.
- 2012
- IEEE Trans Electromagn Compat
Impact of multiple scattering on passivity of equivalent-circuit via models
- - Xiaomin Duan
  - Renato Rimolo-Donadio
  - et al.
- 2011
- EDAPS 2011
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz
- - Renato Rimolo-Donadio
  - Xiaoxiong Gu
  - et al.
- 2009
- IEEE T-MTT