Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2016
- ASME Journal of Electronic Packaging
Paper
Publications
10 results for Chin Lee Ong
Thermal design of a hierarchical radially expanding cavity for two-Phase cooling of integrated circuits
- Arvind Sridhar
- Chin Lee Ong
- et al.
- 2015
- InterPACK 2015
Conference paperBenchmarking study on the thermal management landscape for 3D ICS: from back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2015
- InterPACK 2015
Conference paperWafer-level integration of embedded cooling approaches
- Stephan Paredes
- Yassir Madhour
- et al.
- 2014
- ISSWB 2014
Conference paperExergoeconomic analysis of high concentration photovoltaic thermal co-generation system for space cooling
- Veronica Garcia-Heller
- Stephan Paredes
- et al.
- 2014
- Renewable Sustainable Energy Rev
ReviewAn experimentally optimized model for heat and mass transfer in direct contact membrane distillation
- Ólöf Andrjesdóttir
- Chin Lee Ong
- et al.
- 2013
- Int. J. Heat Mass Transf.
PaperThermal management and overall performance of a high concentration PV
- Werner Escher
- Stephan Paredes
- et al.
- 2012
- CPV 2012
Conference paperA novel concept of energy reuse from high concentration photovoltaic thermal (HCPVT) system for desalination
- Chin Lee Ong
- W. Escher
- et al.
- 2012
- Desalination
PaperUltra-high-concentration photovoltaic-thermal systems based on microfluidic chip-coolers
- M. Müller
- W. Escher
- et al.
- 2011
- CPV 2011
Conference paperExperimental adiabatic two-phase pressure drops of R134a, R236fa and R245fa in small horizontal circular channels
- Chin L. Ong
- John R. Thome
- 2011
- AJTEC 2011
Conference paper