Electromigration path in Cu thin-film lines
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- Applied Physics Letters
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61 results for Robert Rosenberg
The microstructural stability of Al(Cu) lines during electromigration
- T.M. Shaw
- C.-K. Hu
- et al.
- 1995
- Applied Physics Letters
Measurement of thermal stress and stress relaxation in confined metal lines. I. Stresses during thermal cycling
- M.A. Moske
- P.S. Ho
- et al.
- 1993
- Journal of Applied Physics
Dopant redistribution during oxidation of SiGe
- F.K. LeGoues
- R. Rosenberg
- et al.
- 1989
- Applied Physics Letters
Kinetics and mechanism of oxidation of SiGe: Dry versus wet oxidation
- F.K. LeGoues
- R. Rosenberg
- et al.
- 1989
- Applied Physics Letters
Oxidation studies of SiGe
- F.K. LeGoues
- R. Rosenberg
- et al.
- 1989
- Journal of Applied Physics
LARGE AREA PLASMA SPRAY DEPOSITED SUPERCONDUCTING YBa2Cu3O7 THICK FILMS
- J.J. Cuomo
- C. Richard Guarnieri
- et al.
- 1987
- Advanced Ceramic Materials
Effect of a solute addition (Ta) on low temperature self-diffusion processes in gold
- D. Gupta
- R. Rosenberg
- 1975
- Thin Solid Films
Mass transport in layered polycrystalline thin films
- K.N. Tu
- R. Rosenberg
- 1972
- Thin Solid Films
Grain boundary contributions to transport
- R. Rosenberg
- A.F. Mayadas
- et al.
- 1972
- Surface Science