VALUE D0Z* for GRAIN BOUNDARY ELECTROMIGRATION in ALUMINUM FILMS
- R. Rosenberg
- 2003
- Applied Physics Letters
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61 results for Robert Rosenberg
Resistivity of rf sputter-thinned aluminum films
- A.F. Mayadas
- R.T.C. Tsui
- et al.
- 2003
- Applied Physics Letters
Resistance monitoring and effects of nonadhesion during electromigration in aluminum films
- R. Rosenberg
- L. Berenbaum
- 2003
- Applied Physics Letters
Growth of uniaxial magnetic garnet films by rf sputtering
- J.J. Cuomo
- V. Sadagopan
- et al.
- 2003
- Applied Physics Letters
Liner materials for direct electrodeposition of Cu
- M.W. Lane
- C.E. Murray
- et al.
- 2003
- Applied Physics Letters
Reduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters
Electromigration in on-chip single/dual damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- JES
The effect of current density, stripe length, stripe width, and temperature on resistance saturation during electromigration testing
- R. Filippi
- R.A. Wachnik
- et al.
- 2002
- Journal of Applied Physics
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2001
- Applied Physics Letters
Copper metallization for high performance silicon technology
- R. Rosenberg
- D. Edelstein
- et al.
- 2000
- Annual Review of Materials Science