Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ITherm 2016
Conference paper
Publications
5 results for Mario Baum
Re-building the Underfill: Performance of percolating fillers at package scale
- Uwe Zschenderlein
- Mario Baum
- et al.
- 2016
- EuroSimE 2016
Conference paperNanoparticle assembly and sintering towards all-copper flip chip interconnects
- Jonas Zürcher
- Kerry Yu
- et al.
- 2015
- ECTC 2015
Conference paperSelf-assembly of micro- and nano-particles by centrifugal forces and capillary bridging for 3D thermal interconnects
- Christian Hofmann
- Mario Baum
- et al.
- 2015
- SSI 2015
Conference paperCharacterization of particle beds in percolating thermal underfills based on centrifugation
- Severin Zimmermann
- Thomas Brunschwiler
- et al.
- 2014
- 3DIC 2014
Conference paper