Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
Publications
6 results for Uwe Zschenderlein
All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- Jonas Zürcher
- Luca Del Carro
- et al.
- 2016
- ECTC 2016
Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ITherm 2016
Re-building the Underfill: Performance of percolating fillers at package scale
- Uwe Zschenderlein
- Mario Baum
- et al.
- 2016
- EuroSimE 2016
Embedded power insert enabling dual-side cooling of microprocessors
- Thomas Brunschwiler
- Dominic Gschwend
- et al.
- 2015
- ECTC 2015
Advances in percolated thermal underfill (PTU) simulations for 3D-integration
- Sridhar Kumar
- Uwe Zschenderlein
- et al.
- 2015
- EuroSimE 2015