Publications

8 results for Mary Ann Zaitz

Leveraging sub-E0 dose assessment methodology to improve EUV lithography cluster dose performance
- - Chris Robinson
  - Cody Murray
  - et al.
- 2020
- SPIE Advanced Lithography 2020
Post copper CMP hybrid clean process for advanced BEOL technology
- - Wei-Tsu Tseng
  - Vamsi Devarapalli
  - et al.
- 2013
- IEEE Trans Semicond Manuf
Hybrid clean approach for post-copper CMP defect reduction
- - Wei-Tsu Tseng
  - Vamsi Devarapalli
  - et al.
- 2013
- ASMC 2013
High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility
- - Takeshi Nogami
  - Tibor Bolom
  - et al.
- 2010
- IEDM 2010
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- - E. Huang
  - M. Oh
  - et al.
- 2009
- ADMETA 2009
CVD Co and its application to Cu damascene interconnections
- - Takeshi Nogami
  - J. Maniscalco
  - et al.
- 2010
- IITC 2010
Nanoporous materials integration into advanced microprocessors
- - E. Todd Ryan
  - Cathy Labelle
  - et al.
- 2005
- MRS Spring Meeting 2005
Effects of wafer cleaning reduction on metals removal and ultrathin gate oxide quality
- - C. D'Emic
  - S. Cohen
  - et al.
- 1997
- MRS Spring Meeting 1997