Adhesion of poly(arylene ether benzimidazole) to copper and polyimides
- K.-W. Lee
- A. Viehbeck
- et al.
- 1996
- Journal of Adhesion Science and Technology
Paper
Publications
34 results for Kang-Wook Lee
UV modification of surface pretilt of alignment layers for multidomain liquid crystal displays
- Alan Lien
- R.A. John
- et al.
- 1995
- Applied Physics Letters
PaperA Study of Case II Transport by Laser Interferometry
- C.J. Durning
- M.M. Hassan
- et al.
- 1995
- Macromolecules
PaperAdhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
Conference paperEffects of polyimide surface structure on liquid crystal alignment
- K.-W. Lee
- S.A. Lien
- et al.
- 1995
- SPE ANTEC 1995
Conference paperGrowth of ODPA-APB polyimide films using molecular beam deposition, and their characterization
- Christos D. Dimitrakopoulos
- Steven P. Kowalczyk
- et al.
- 1995
- Polymer
PaperFormation of polyimide–Cu complexes: improvement of direct Cu-on-PI and PI-on-Cu adhesion
- K.-W. Lee
- G.F. Walker
- et al.
- 1995
- Journal of Adhesion Science and Technology
PaperOrganic passivation of copper for MCM-D packaging
- K.-W. Lee
- G.F. Walker
- et al.
- 1994
- International SAMPE Electronics Conference 1994
Conference paperA Surface Acoustic Wave Sensor Study of Polyimide Thin Film Surface Treatments — Effect on Water Uptake
- D.W. Galipeau
- P.R. Story
- et al.
- 1994
- Journal of Adhesion Science and Technology
PaperModification of polyimide surface morphology: relationship between modification depth and adhesion strength
- Kang-Wook Lee
- 1994
- Journal of Adhesion Science and Technology
Paper