Publications

31 results for Matthew Angyal

Interconnect performance and scaling strategy for the 22 nm node and beyond
- - James H.-C. Chen
  - Lijun Jiang
  - et al.
- 2008
- ADMETA 2008
Technology elements of a common platform bulk foundry offering (invited)
- - P. Gilbert
  - A. Steegen
  - et al.
- 2007
- IEDM 2007
Characterization, Modeling and Extraction of Cu Wire Resistance for 65 nm Technology
- - Ning Lu
  - M. Angyal
  - et al.
- 2007
- CICC 2007
BEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65nm groundrules
- - S. Lane
  - M. Fukasawa
  - et al.
- 2005
- AMC 2005
A SiCOH BEOL interconnect technology for high density and high performance 65 nm CMOS applications
- - Matthew Angyal
  - Jason Gill
  - et al.
- 2005
- AMC 2005
BEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65 nm groundrules
- - M. Fukasawa
  - S. Lane
  - et al.
- 2005
- IITC 2005
Low-k/copper integration scheme suitable for ULSI manufacturing from 90nm to 45nm nodes
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- Optics East 2005
Lower-k SiCOH integration for 65 nm ground rules
- - T. Nogami
  - S. Lane
  - et al.
- 2005
- VMIC 2005
High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
- - E. Leobandung
  - H. Nayakama
  - et al.
- 2005
- VLSI Technology 2005
A 90nm dual damascene hybrid (organic / inorganic) low-k - Copper BEOL integration scheme
- - T. Dalton
  - A. Cowley
  - et al.
- 2003
- ADMETA 2003