Publications

3 results for Scott Lefevre

Characterization of TSV etch from a sustainability standpoint
- - Osakpolo Isowamwen
  - Nathan Marchack
  - et al.
- 2023
- SPIE Advanced Lithography 2023
Control of sidewall roughness formation in through-silicon via etch at non-cryogenic temperatures
- - John M. Papalia
  - Devi Koty
  - et al.
- 2022
- SPIE Advanced Lithography 2022
DSA patterning options for logics and memory applications
- - Chi Chun Liu
  - Elliott Franke
  - et al.
- 2017
- SPIE Advanced Lithography 2017