Phase transformation of thin sputter-deposited tungsten films at room temperature
- S.M. Rossnagel
- I.C. Noyan
- et al.
- 2002
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
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97 results for Stephen Rossnagel
Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
- H. Kim
- C. Cabral
- et al.
- 2002
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Growth kinetics and initial stage growth during plasma-enhanced Ti atomic layer deposition
- H. Kim
- S.M. Rossnagel
- 2002
- Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films
Plasma-enhanced atomic layer deposition of Ta and Ti for interconnect diffusion barriers
- S.M. Rossnagel
- A. Sherman
- et al.
- 2000
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Fabrication and performance limits of sub-0.1 μm Cu interconnects
- T.S. Kuan
- C.K. Inoki
- et al.
- 2000
- Materials Research Society Symposium-Proceedings
Thermal stability and oxygen-loss characteristics of Pt(O) films prepared by reactive sputtering
- K.L. Saenger
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
Sputter deposition for semiconductor manufacturing
- S.M. Rossnagel
- 1999
- IBM J. Res. Dev
Fabrication of Cu interconnects of 50 nm linewidth by electron-beam lithography and high-density plasma etching
- Y. Hsu
- T. Standaert
- et al.
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Interaction between gas rarefaction and metal ionization in ionized physical vapor deposition
- S.M. Rossnagel
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Directional and ionized physical vapor deposition for microelectronics applications
- S.M. Rossnagel
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures