Robust TaN x diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
- H. Kim
- C. Detavenier
- et al.
- 2005
- Journal of Applied Physics
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97 results for Stephen Rossnagel
The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
- H. Kim
- C. Lavoie
- et al.
- 2004
- Journal of Applied Physics
Alteration of Cu conductivity in the size effect regime
- S.M. Rossnagel
- T.S. Kuan
- 2004
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Plasma-enhanced atomic layer deposition of tantalum thin films: The growth and film properties
- H. Kim
- S.M. Rossnagel
- 2003
- Thin Solid Films
Thin film deposition with physical vapor deposition and related technologies
- S.M. Rossnagel
- 2003
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Thermodynamics and kinetics of room-temperature microstructural evolution in copper films
- C. Detavernier
- S.M. Rossnagel
- et al.
- 2003
- Journal of Applied Physics
Diffusion barrier properties of very thin TaN with high nitrogen concentration
- S.M. Rossnagel
- H. Kim
- 2003
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Characteristics of ultrathin Ta and TaN films
- S.M. Rossnagel
- 2002
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
- Hyungjun Kim
- A.J. Kellock
- et al.
- 2002
- Journal of Applied Physics
Time development of microstructure and resistivity for very thin Cu films
- S.M. Rossnagel
- T.S. Kuan
- 2002
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films