Advanced metal and dielectric barrier cap films for Cu low k interconnectsDeepika PriyadarshiniSon Nguyenet al.2014IITC/AMC 2014
Ultrathin (8-14 nm) conformal SiN for sub-20 nm Copper/Low-k InterconnectsSon Van NguyenDeepika Priyadarshiniet al.2014ECS Meeting 2014
Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects - State of the artAlfred GrillStephen M. Gateset al.2014Applied Physics Reviews