Chip package interaction evaluation for a high performance 65nm and 45nm CMOS technology in a stacked die package with C4 and wirebond interconnections
- Christopher Muzzy
- David Danovitch
- et al.
- 2008
- ECTC 2008
Publications
Date
Featured collections
Popular topics
6 results for Emily R. Kinser
Regulation of Mesenchymal Stem Cell Differentiation by Nanopatterning of Bulk Metallic Glass
- Ayomiposi M. Loye
- Emily R. Kinser
- et al.
- 2018
- Scientific Reports
Regulation of cell-cell fusion by nanotopography
- Jagannath Padmanabhan
- Michael J. Augelli
- et al.
- 2016
- Scientific Reports
Engineering cellular response using nanopatterned bulk metallic glass
- Jagannath Padmanabhan
- Emily R. Kinser
- et al.
- 2014
- ACS Nano
Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
- R.R. Yu
- F. Liu
- et al.
- 2009
- VLSI Technology 2009
Nanopatterned Bulk Metallic Glass Biosensors
- Emily R. Kinser
- Jagannath Padmanabhan
- et al.
- 2017
- ACS Sensors