Publications

148 results for Thomas M. Shaw

Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- - D. Edelstein
  - C.R. Davis
  - et al.
- 2004
- IITC 2004
Optimization of SiCOH dielectrics for integration in a 90 nm CMOS technology
- - A. Grill
  - D. Edelstein
  - et al.
- 2004
- IITC 2004
Channel cracking in low-k films on patterned multi-layers
- - X.-H. Liu
  - T.M. Shaw
  - et al.
- 2004
- IITC 2004
90 nm SiCOH technology in 300 mm manufacturing
- - L. Clevenger
  - M. Yoon
  - et al.
- 2004
- ADMETA 2004
Reliability challenges with ultra-low k interlevel dielectrics
- - J.R. Lloyd
  - M. Lane
  - et al.
- 2004
- Microelectronics Reliability
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- - R. Filippi
  - J.F. McGrath
  - et al.
- 2004
- IRPS 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- - D. Edelstein
  - H.S. Rathore
  - et al.
- 2004
- IRPS 2004
Environmental effects on cracking and delamination of dielectric films
- - Michael W. Lane
  - Xia Hu Liu
  - et al.
- 2004
- IEEE T-DMR
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- - D. Edelstein
  - H.S. Rathore
  - et al.
- 2004
- IRPS 2004
Thermal cycle reliability of stacked via structures with copper metallization and an organic low-k dielectric
- - R. Filippi
  - J.F. McGrath
  - et al.
- 2004
- IRPS 2004