Publications

148 results for Thomas M. Shaw

Chip-package-interaction modeling of ultra low-k/copper back end of line
- - X.-H. Liu
  - T.M. Shaw
  - et al.
- 2007
- IITC 2007
Delamination in patterned films
- - X.-H. Liu
  - M.W. Lane
  - et al.
- 2007
- Int. J. Solids Struct.
Physical, electrical, and reliability characterization of Ru for Cu interconnects
- - C.-C. Yang
  - T. Spooner
  - et al.
- 2006
- IITC 2006
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- - S. Sankaran
  - S. Arai
  - et al.
- 2006
- IEDM 2006
Formation and Microstructure of Mg‐Si‐O–N Glasses
- - T.M. SHAW
  - G. THOMAS
  - et al.
- 2006
- JACerS
Thermal stress evolution in embedded Cu/low-k dielectric composite features
- - Conal E. Murray
  - Charles C. Goldsmith
  - et al.
- 2006
- Applied Physics Letters
65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOH
- - V. McGahay
  - G. Bonilla
  - et al.
- 2006
- IITC 2006
Theory for electromigration failure in Cu conductors
- - J.R. Lloyd
  - C.E. Murray
  - et al.
- 2005
- International Workshop on Stress-Induced Phenomena in Metallization 2005
Role of oxygen vacancies in V_FB/V_t stability of pFET metals on HfO₂
- - E. Cartier
  - F.R. McFeely
  - et al.
- 2005
- VLSI Technology 2005
Effect of moisture on the Time Dependent Dielectric Breakdown (TDDB) behavior in an ultra-low-k (ULK) dielectric
- - J.R. Lloyd
  - T.M. Shaw
  - et al.
- 2005
- IIRW 2005