Publications

148 results for Thomas M. Shaw

Reliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding
- - K.N. Chen
  - T.M. Shaw
  - et al.
- 2010
- IEDM 2010
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
- - Eric G. Liniger
  - T.M. Shaw
  - et al.
- 2010
- ADMETA 2010
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- - E. Huang
  - M. Oh
  - et al.
- 2009
- ADMETA 2009
Ultrathin (5-35 nm) SiCNH dielectrics for damascene Cu Cap application: Thickness scaling and oxidation barrier performance limitation
- - Son Nguyen
  - T. Haigh Jr.
  - et al.
- 2010
- ECS Meeting 2010
CVD Co and its application to Cu damascene interconnections
- - Takeshi Nogami
  - J. Maniscalco
  - et al.
- 2010
- IITC 2010
Characterization of "ultrathin-Cu"/Ru(Ta)/TaN liner stack for copper interconnects
- - C.-C. Yang
  - S. Cohen
  - et al.
- 2010
- IEEE Electron Device Letters
Effects of contact area on mechanical strength, electrical resistance, and electromigration reliability of Cu/Low- k interconnects
- - C.-C. Yang
  - T.M. Shaw
  - et al.
- 2010
- Electrochemical and Solid-State Letters
Stress relaxation in Cu thin films
- - C. Witt
  - R. Rosenberg
  - et al.
- 2008
- International Workshop on Stress-Induced Phenomena in Metallization 2008
Reliability of a 300-mm-compatible 3DI technology based on hybrid Cu-adhesive wafer bonding
- - R.R. Yu
  - F. Liu
  - et al.
- 2009
- VLSI Technology 2009
On the contribution of line-edge roughness to intralevel TDDB lifetime in low-k dielectrics
- - J.R. Lloyd
  - X.-H. Liu
  - et al.
- 2009
- IRPS 2009