Techniques for de-embedding a high port count connector to PCB via interposer
- Yan Ding
- Young H. Kwark
- et al.
- 2011
- ECTC 2011
Publications
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43 results for Lei Shan
Layer misregistration in PCB and its effects on signal propagation
- Lei Shan
- Young Kwark
- et al.
- 2010
- ECTC 2010
A study on crosstalk analysis in aggregative transmission lines with turning vias
- Tapobrata Bandyopadhyay
- Lei Shan
- et al.
- 2009
- ECTC 2009
Is 25 Gb/s on-board signaling viable?
- Dong G. Kam
- Mark B. Ritter
- et al.
- 2009
- IEEE Transactions on Advanced Packaging
Multi-level signaling in high-density, high-speed electrical links
- Dong G. Kam
- Troy J. Beukema
- et al.
- 2008
- DesignCon 2008
The viability of 25 Gb/s on-board signalling
- Mark B. Ritter
- Petar Pepeljugoski
- et al.
- 2008
- ECTC 2008
Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond
- Petar Pepeljugoski
- Mark Ritter
- et al.
- 2008
- SPIE IOPTO 2008
Signal propagation over perforated reference planes
- Lei Shan
- Mark Ritter
- et al.
- 2007
- IEEE-SPI 2007
Packaging considerations for high-speed single-ended and differential nets
- Lei Shan
- Mohit Kapur
- et al.
- 2006
- ECTC 2006
Design optimization for isolation in high wiring density packages with high speed SerDes links
- Nju Na
- Jean Audet
- et al.
- 2006
- ECTC 2006