Publications

43 results for Lei Shan

Techniques for de-embedding a high port count connector to PCB via interposer
- - Yan Ding
  - Young H. Kwark
  - et al.
- 2011
- ECTC 2011
Layer misregistration in PCB and its effects on signal propagation
- - Lei Shan
  - Young Kwark
  - et al.
- 2010
- ECTC 2010
A study on crosstalk analysis in aggregative transmission lines with turning vias
- - Tapobrata Bandyopadhyay
  - Lei Shan
  - et al.
- 2009
- ECTC 2009
Is 25 Gb/s on-board signaling viable?
- - Dong G. Kam
  - Mark B. Ritter
  - et al.
- 2009
- IEEE Transactions on Advanced Packaging
Multi-level signaling in high-density, high-speed electrical links
- - Dong G. Kam
  - Troy J. Beukema
  - et al.
- 2008
- DesignCon 2008
The viability of 25 Gb/s on-board signalling
- - Mark B. Ritter
  - Petar Pepeljugoski
  - et al.
- 2008
- ECTC 2008
Comparison of bandwidth limits for on-card electrical and optical interconnects for 100 Gb/s and beyond
- - Petar Pepeljugoski
  - Mark Ritter
  - et al.
- 2008
- SPIE IOPTO 2008
Signal propagation over perforated reference planes
- - Lei Shan
  - Mark Ritter
  - et al.
- 2007
- IEEE-SPI 2007
Packaging considerations for high-speed single-ended and differential nets
- - Lei Shan
  - Mohit Kapur
  - et al.
- 2006
- ECTC 2006
Design optimization for isolation in high wiring density packages with high speed SerDes links
- - Nju Na
  - Jean Audet
  - et al.
- 2006
- ECTC 2006