Publications

61 results for Cornelia Tsang

300-Gb/s 24-channel bidirectional Si carrier transceiver optochip for board-level interconnects
- - Fuad E. Doany
  - Clint L. Schow
  - et al.
- 2008
- ECTC 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- - K. Sakuma
  - P. Andry
  - et al.
- 2008
- ECTC 2008
300-Gb/s, 24-channel full-duplex, 850-nm, cmos-based optical transceivers
- - C.L. Schow
  - F.E. Doany
  - et al.
- 2008
- OFC/NFOEC 2008
3D chip stacking with C4 technology
- - Bing Dang
  - Steven L. Wright
  - et al.
- 2008
- IBM J. Res. Dev
3D chip-stacking technology with through-silicon vias and low-volume lead free interconnections
- - Katsuyuki Sakuma
  - Paul S. Andry
  - et al.
- 2008
- IBM J. Res. Dev
Fabrication and characterization of robust through-silicon vias for silicon-carrier applications
- - Paul S. Andry
  - Cornelia K. Tsang
  - et al.
- 2008
- IBM J. Res. Dev
Three-dimensional silicon integration
- - John U. Knickerbocker
  - Paul S. Andry
  - et al.
- 2008
- IBM J. Res. Dev
High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques
- - N. Hoivik
  - D. Liu
  - et al.
- 2007
- APS 2007
Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- - B. Dang
  - S.L. Wright
  - et al.
- 2007
- ECTC 2007
3D chip stacking technology with low-volume lead-free interconnections
- - K. Sakuma
  - P. Andry
  - et al.
- 2007
- ECTC 2007