Microfluidic Interposer for High Performance Fluidic Chip CoolingWolfram StellerFrank Windrichet al.2018ESTC 2018Conference paper
Stress investigations in 3D-integrated silicon microstructuresM. StiebingEmanuel Lörtscheret al.2016EuroSimE 2016Conference paper
3D Si-level integration in wireless sensor nodePiet Van EngenRic Van Doremalenet al.2009SSI 2009Conference paper