Publications

37 results for Gerd Schlottig

All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
- - Jonas Zürcher
  - Luca Del Carro
  - et al.
- 2016
- ECTC 2016
Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K
- - Thomas Brunschwiler
  - Jonas Zürcher
  - et al.
- 2016
- ITherm 2016
Re-building the Underfill: Performance of percolating fillers at package scale
- - Uwe Zschenderlein
  - Mario Baum
  - et al.
- 2016
- EuroSimE 2016
Master curve synthesis by effective viscoelastic plastic material modeling
- - Florian Schindler-Saefkow
  - Remi Pantou
  - et al.
- 2016
- EuroSimE 2016
Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- - Thomas Brunschwiler
  - Arvind Sridhar
  - et al.
- 2016
- ASME Journal of Electronic Packaging
Lid-integral cold-plate topology: Integration, performance, and reliability
- - Gerd Schlottig
  - Marco De Fazio
  - et al.
- 2016
- ASME Journal of Electronic Packaging
Quantifying the thermal conductivity enhancement of percolating thermal underfills
- - Brian R. Burg
  - Jonas Zürcher
  - et al.
- 2015
- EMPC 2015
A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study
- - Chander Shekhar Sharma
  - Gerd Schlottig
  - et al.
- 2015
- Int. J. Heat Mass Transf.
Nanoparticle assembly and sintering towards all-copper flip chip interconnects
- - Jonas Zürcher
  - Kerry Yu
  - et al.
- 2015
- ECTC 2015
Benchmarking study on the thermal management landscape for 3D ICS: from back-side to volumetric heat removal
- - Thomas Brunschwiler
  - Arvind Sridhar
  - et al.
- 2015
- InterPACK 2015