Co-package technology platform for low-power and low-cost data centers
- Konstantinos Papatryfonos
- David R. Selviah
- et al.
- 2021
- Applied Sciences
Paper
Publications
7 results for Hermann Oppermann
Microfluidic Interposer for High Performance Fluidic Chip Cooling
- Wolfram Steller
- Frank Windrich
- et al.
- 2018
- ESTC 2018
Conference paperDual-Side Heat Removal by Silicon Cold Plate and Interposer with Embedded Fluid Channels
- Thomas Brunschwiler
- Wolfram Steller
- et al.
- 2018
- ITherm 2018
Conference paperTowards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- IEDM 2017
Conference paperIntra-stack sealing of tier interconnects using the interconnect alloy
- Jessica Kleff
- Gerd Schlottig
- et al.
- 2016
- ESTC 2016
Conference paperForced convective interlayer cooling in vertically integrated packages
- Thomas Brunschwiler
- Bruno Michel
- et al.
- 2008
- ITherm 2008
Conference paperInterlayer cooling potential in vertically integrated packages
- T. Brunschwiler
- Bruno Michel
- et al.
- 2008
- Microsystem Technologies
Paper