Publications

30 results for Wei-Tsu Tseng

Hybrid clean approach for post-copper CMP defect reduction
- - Wei-Tsu Tseng
  - Vamsi Devarapalli
  - et al.
- 2013
- ASMC 2013
Reducing density-induced CMP non-uniformity for advanced semiconductor technology nodes
- - John H. Zhang
  - Wei-Tsu Tseng
  - et al.
- 2013
- MRS Spring Meeting 2013
Cu CMP and its challenge for 20nm nodes and beyond
- - John H. Zhang
  - Wei-Tsu Tseng
  - et al.
- 2012
- MRS Spring Meeting 2012
Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes
- - Wei-Tsu Tseng
  - Donald Canaperi
  - et al.
- 2012
- ASMC 2012
Formation mechanism and suppression methods of copper dendrites in BEOL integration
- - Shaoning Yao
  - Wei-Tsu Tseng
  - et al.
- 2011
- ADMETA 2011
Using CMP model for 45nm/32nm BEOL process and design evaluations
- - Laertis Economikos
  - Jerry Bao
  - et al.
- 2010
- ECS Meeting 2010
Cu CMP edge uniformity improvement studies for 32 nm technology node and beyond
- - John H. Zhang
  - Laertis Economikos
  - et al.
- 2010
- MRS Online Proceedings Library
Material and process for advanced Cu/ULK integration
- - Chih-Chao Yang
  - Daniel C. Edelstein
  - et al.
- 2008
- ADMETA 2008
Evaluation of barrier CMP slurries and characterization of ULK material properties shifts due to CMP
- - Wei-Tsu Tseng
  - Dimitri Kioussis
  - et al.
- 2008
- ECS Meeting 2008
Evaluation of Cu CMP barrier slurries for Ultra Low-k dielectric film (k~2.4) for 45nm technology
- - Feng Zhao
  - Laertis Economikos
  - et al.
- 2007
- ICPT 2007