Evaluation of Cu wiring in a production 64 Mb DRAM
- W. Cote
- G. Costrini
- et al.
- 1998
- VLSI Technology 1998
Publications
146 results for Daniel Edelstein
Spiral and solenoidal inductor structures on silicon using Cu-damascene interconnects
- D. Edelstein
- J.N. Burghartz
- 1998
- IITC 1998
Copper dual damascene wiring for sub-0.25 μm CMOS technology
- J. Heidenreich
- D. Edelstein
- et al.
- 1998
- IITC 1998
Copper ULSI interconnect technology
- D. Edelstein
- 1998
- MRS Spring 1998
RF circuit design aspects of spiral inductors on silicon
- J.N. Burghartz
- D. Edelstein
- et al.
- 1998
- ISSCC 1998
Spiral inductors and transmission lines in silicon technology using copper-damascene interconnects and low-loss substrates
- Joachim N. Burghartz
- Daniel C. Edelstein
- et al.
- 1997
- IEEE T-MTT
Full copper wiring in a sub-0.25 μm CMOS ULSI technology
- D. Edelstein
- J. Heidenreich
- et al.
- 1997
- IEDM 1997
Monolithic Spiral Inductors Fabricated Using a VLSI Cu-Damascene Interconnect Technology and Low-Loss Substrates
- J.N. Burghartz
- D. Edelstein
- et al.
- 1996
- IEDM 1996
Diamondlike carbon materials as low-k dielectrics for multilevel interconnects in ULSI
- A. Grill
- V.V. Patel
- et al.
- 1996
- MRS Fall Meeting 1996
VLSI on-chip interconnection performance simulations and measurements
- D. Edelstein
- G.A. Sai-Halasz
- et al.
- 1995
- IBM J. Res. Dev