Channel cracking in low-k films on patterned multi-layers
- X.-H. Liu
- T.M. Shaw
- et al.
- 2004
- IITC 2004
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144 results for Daniel Edelstein
Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
- D. Edelstein
- C.R. Davis
- et al.
- 2004
- IITC 2004
90 nm SiCOH technology in 300 mm manufacturing
- L. Clevenger
- M. Yoon
- et al.
- 2004
- ADMETA 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-K dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Measurements of effective thermal conductivity for advanced interconnect structures with various composite low-k dielectrics
- F. Chen
- J. Gill
- et al.
- 2004
- IRPS 2004
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
- D. Edelstein
- H.S. Rathore
- et al.
- 2004
- IRPS 2004
Moisture and oxygen uptake in Low K/ copper interconnect structures
- T.M. Shaw
- D. Jimerson
- et al.
- 2003
- ADMETA 2003
SiCOH dielectrics: From low-κ to Ultralow-κ by PECVD
- A. Grill
- D. Edelstein
- et al.
- 2001
- ADMETA 2001
An optimal liner for copper damascene interconnects
- D. Edelstein
- C. Uzoh
- et al.
- 2001
- ADMETA 2001