High-Resolution Nanoscale X-ray Imaging for Non-Destructive Inspection of Copper Grains in Fine-Pitch Pads for Hybrid Bonding
- Nimish Nazirkar
- Nicholas Polomoff
- et al.
- 2026
- ECTC 2026
Conference paper
Publications
2 results for James Lu
Hybrid bonding surface roughness characterization: A RHEED approach with high speed and atomic scale (sub-nm) sensitivity at wafer level
- Weichang Lin
- Nicholas Polomoff
- et al.
- 2026
- ECTC 2026
Talk