Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping processChinami MarushimaToyohiro Aokiet al.2021ICEP 2021Conference paper
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technologyEiji NakamuraToyohiro Aokiet al.2021Advancing MicroelectronicsPaper
Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip JoiningToyohiro AokiEiji Nakamuraet al.2020ECTC 2020Conference paper